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506-AG11D-ESL-LF

5S-506-AG11D-ESL-LF
506-AG11D-ESL-LF
CONN IC DIP SOCKET 6POS GOLD
In stock
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Product Description
Packaging:Tube
Series:500
Type:DIP
Number of Positions or Pins (Grid):0.3 (7.62mm) Row Spacing
Pitch - Mating:6 (2 x 3)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:Flash
Mounting Type:Beryllium Copper
Features:Through Hole
Termination:Closed Frame
Pitch - Post:Solder
Contact Finish - Post:0.100 (2.54mm)
Contact Finish Thickness - Post:Gold
Contact Material - Post:Flash
Housing Material:Nickel
Operating Temperature:Polycyclohexylenedimethylene Terephthalate (PCT)
Other:Polyester,-55??????C ~ 125??????C,
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