50-9518-10H

5S-50-9518-10H
50-9518-10H
CONN IC DIP SOCKET 50POS GOLD
In stock
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Product Description
Packaging:Bulk
Series:518
Type:DIP
Number of Positions or Pins (Grid):0.9 (22.86mm) Row Spacing
Pitch - Mating:50 (2 x 25)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:10??????in (0.25??????m)
Mounting Type:Beryllium Copper
Features:Through Hole
Termination:Open Frame
Pitch - Post:Solder
Contact Finish - Post:0.100 (2.54mm)
Contact Finish Thickness - Post:Tin
Contact Material - Post:200??????in (5.08??????m)
Housing Material:Brass
Operating Temperature:Polyamide (PA46)
Other:Nylon 4/6,Glass Filled,-
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