32-6556-30

5S-32-6556-30
32-6556-30
CONN IC DIP SOCKET 32POS GOLD
In stock
L/C, T/T, Western Union, Paypal
Shipping Immediately ASAP
Product Description
Packaging:Bulk
Series:6556
Type:DIP
Number of Positions or Pins (Grid):0.6 (15.24mm) Row Spacing
Pitch - Mating:32 (2 x 16)
Contact Finish - Mating:0.100 (2.54mm)
Contact Finish Thickness - Mating:Gold
Contact Material - Mating:30??????in (0.76??????m)
Mounting Type:Beryllium Copper
Features:Through Hole
Termination:Open Frame
Pitch - Post:Wire Wrap
Contact Finish - Post:0.100 (2.54mm)
Contact Finish Thickness - Post:Tin
Contact Material - Post:200??????in (5.08??????m)
Housing Material:Brass
Operating Temperature:Polyphenylene Sulfide (PPS)
Other:Glass Filled,-,
Related special

  • 3-640252-1
  • TE Connectivity
  • Socket Contact Tin 18-24 AWG Crimp Power
  • In stock
  • 39012021
  • Molex
  • 2 Rectangular Connectors - Housings Plug Natural
  • In stock
  • 39012085
  • Molex
  • 8 Rectangular Connectors Housings Receptacle Natural 0.165"(4.20mm)
  • In stock
  • 350536-1
  • TE Connectivity AMP Connectors
  • TE AMP CONN SOCKET 14-20AWG CRIMP TIN
  • In stock
  • 350561-1
  • TE Connectivity AMP Connectors
  • CONN PIN 18-24AWG CRIMP TIN
  • In stock
  • 3656KG
  • Texas Instruments
  • IC OPAMP ISOLATION 30KHZ 20CDIP
  • In stock