Epcos / RF360

RF360 - A Qualcomm-TDK joint venture - We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial. Related product brands include: TDK Corporation, TDK InvenSense, TDK Micronas, TDK Tronics, TDK-Lambda Inc., EPCOS

Epcos / RF360 News
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